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Introduction to AS4C512M16D3LA-10BIN

Author: Tanssion Date: 2023-04-25 Hits: 196

AS4C512M16D3LA-10BIN is a type of synchronous dynamic random-access memory (SDRAM) module produced by Alliance Memory.

AS4C512M16D3LA-10BIN

Here's a breakdown of the code:

AS4C: This indicates the type of memory, which in this case is SDRAM.

512M: This refers to the memory capacity, which is 512 megabits (Mb).

16: This refers to the number of data pins on the module, which is 16.

D3: This indicates the type of DDR SDRAM, which is DDR3.

LA: This indicates the package type, which in this case is a 96-ball FBGA package.

10: This refers to the speed of the memory, which is 10 nanoseconds (ns) cycle time.

BIN: This indicates that the memory is sorted and tested to meet specific performance criteria.


Overall, AS4C512M16D3LA-10BIN is a DDR3 SDRAM module with a capacity of 512 Mb and a cycle time of 10 ns, packaged in a 96-ball FBGA package, and is tested to meet specific performance criteria.


The AS4C512M16D3LA-10BIN is a 512 Megabit (Mb) Double Data Rate 3 (DDR3) Synchronous Dynamic Random-Access Memory (SDRAM) module manufactured by Alliance Memory.


This memory module has a total capacity of 512 Mb, which is organized as 16 Megabytes (MB) x 16 bits. It uses DDR3 technology, which means that it transfers data twice per clock cycle, resulting in a higher data transfer rate compared to DDR2 SDRAM.


The AS4C512M16D3LA-10BIN has a clock cycle time of 10 nanoseconds (ns), which means it has a memory bus speed of 100 MHz. It operates at a voltage of 1.5V and has a JEDEC-standard 96-ball FBGA (Fine-pitch Ball Grid Array) package, which is a type of surface-mount packaging that allows for a higher pin count.


The -10BIN suffix indicates that this module is tested and sorted to meet specific performance criteria, ensuring reliability and compatibility with various computing systems.


Overall, the AS4C512M16D3LA-10BIN is a high-speed and reliable memory module designed for use in various computing applications, including desktops, laptops, and servers.



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Frequently Asked Questions

1、Mechanical Features of AS4C512M16D3LA-10BIN
The AS4C512M16D3LA-10BIN memory module is designed to fit into a standard DDR3 SDRAM slot on a computer's motherboard. The mechanical features of the module include: Form Factor: The AS4C512M16D3LA-10BIN has a standard 240-pin dual in-line memory module (DIMM) form factor, which is used in desktop and server computers. Dimensions: The module has a physical size of 133.35mm x 30mm x 4.2mm (5.25" x 1.18" x 0.165"), which conforms to the JEDEC standard for DDR3 DIMMs. Pin Configuration: The module has a total of 240 pins, arranged into two rows of 120 pins each. The pins are spaced at a distance of 0.75mm from each other, which is a standard feature of DDR3 DIMMs. Package Type: The AS4C512M16D3LA-10BIN is packaged in a 96-ball FBGA (Fine-pitch Ball Grid Array) package, which is a type of surface-mount packaging that allows for a higher pin count in a smaller area. Operating Temperature: The module is designed to operate over a temperature range of 0°C to 95°C (32°F to 203°F), which makes it suitable for use in a wide range of computing environments. Overall, the AS4C512M16D3LA-10BIN module has standard mechanical features that allow it to fit into most desktop and server computers that support DDR3 SDRAM.
2、Electrical Characteristics of AS4C512M16D3LA-10BIN
The electrical characteristics of the AS4C512M16D3LA-10BIN DDR3 SDRAM module include: Voltage: The module is designed to operate at a voltage of 1.5V, which is the standard voltage for DDR3 memory. Frequency: The memory module operates at a maximum frequency of 100 MHz, which corresponds to a clock cycle time of 10 ns. Data Rate: The DDR3 technology used in this module transfers data twice per clock cycle, resulting in a data transfer rate of up to 1600 MT/s (Mega Transfers per second). Latency: The module has a CAS Latency (CL) of 10 cycles, which represents the number of clock cycles it takes to access data in the memory array. Signal Integrity: The module has a stub-series terminated logic (SSTL) interface, which is a differential signaling technology that helps to maintain signal integrity at high frequencies and reduces power consumption. Power Consumption: The module has a maximum power consumption of 1.35 watts (W) in active mode and 0.15 W in standby mode, which makes it an energy-efficient option for computing systems. Overall, the AS4C512M16D3LA-10BIN DDR3 SDRAM module has standard electrical characteristics that allow it to function efficiently in various computing systems.

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