SN74LVC2G79YEPR Part Number Details

Frequently Asked Questions

1、Replacement model of the product with part number SN74LVC2G79YEPR

The SN74LVC2G79YEPR is a specific part number for an integrated circuit (IC) manufactured by Texas Instruments. It is a dual positive-edge-triggered D-type flip-flop with set and reset functionality. If you are looking for a replacement or an alternative to this specific part number, you can consider the following options: 1.SN74LVC2G74: This is another dual positive-edge-triggered D-type flip-flop IC from Texas Instruments. While it may not have the exact same pinout as the SN74LVC2G79YEPR, it can perform similar functions and may be a suitable replacement in many applications. 2.Other Manufacturers: Many semiconductor manufacturers produce similar dual D-type flip-flop ICs that can be used as alternatives. Some popular manufacturers include NXP Semiconductors, ON Semiconductor, STMicroelectronics, and Analog Devices. You can search for dual D-type flip-flop ICs from these manufacturers and check their datasheets for suitability as replacements. When selecting a replacement IC, it's important to consider the electrical characteristics, pin compatibility, and functional requirements of your application. I recommend consulting the datasheets of the suggested replacement ICs to ensure compatibility and proper functionality in your specific application. It's always best to consult the manufacturer or authorized distributors for further guidance and specific recommendations based on your application requirements. They can provide more detailed information and assistance in selecting the most suitable replacement IC for your needs.

2、Package type of the product with part number SN74LVC2G79YEPR

The package type for the SN74LVC2G79YEPR is not specified in the provided part number. However, Texas Instruments offers various package options for their ICs, and the specific package type may vary depending on the manufacturer's offerings and availability. Common package types for ICs like the SN74LVC2G79YEPR include: 1.DSBGA (Dual Small Ball Grid Array): This is a small outline package with tiny solder balls arranged in a grid on the bottom of the package. It is commonly used for miniaturized and space-constrained applications. 2.SOT (Small Outline Transistor): This is a small surface-mount package with gull-wing leads. It is widely used for general-purpose ICs. 3.TSSOP (Thin Shrink Small Outline Package): This is a thin and compact surface-mount package with gull-wing or J-lead configuration. It offers a higher pin density compared to the standard SOIC package. 4.VSSOP (Very Small Shrink Small Outline Package): This is a smaller version of the TSSOP package with a higher pin density and reduced footprint. 5.BGA (Ball Grid Array): This is a package type with solder balls arranged in a grid pattern on the bottom of the package. It is used for ICs with high pin count and provides good electrical and thermal performance. To determine the exact package type for the SN74LVC2G79YEPR, it is recommended to refer to the datasheet or product documentation provided by Texas Instruments. The datasheet will provide detailed information about the package dimensions, pin configuration, and mechanical drawings for the specific part number.